What we produce

Full manufacturing capabilities

From prototypes to production runs — 1 to 6 layers, FR4 and IMS Aluminium, 0.51–2.4 mm thickness.

Made in EU Manufactured in Iași, Romania (EU) — certificate of origin available on request.

Board types & stackups

Hover or tap a card to see its layer stack-up

Single Layer (1L)

Cu · FR4 · Solder Mask Learn more →

Double Layer (2L)

2× Cu · FR4 · Solder Mask Learn more →

IMS Aluminium

Cu · Dielectric · Aluminium Learn more →

4-Layer Multilayer

4× Cu · Core · Prepreg Learn more →

6-Layer Multilayer

6× Cu · 2 Core · Prepreg Learn more →

Technical Details

Built from quality raw materials

Our PCBs are produced using quality raw materials, with the following characteristics:

Laminate: FR4, IMS (Aluminium substrate)

Single layer, double layer, four-layer and six-layer printed circuit board production

Material thickness: 0.51 mm – 2.4 mm

Copper layer thickness: 18, 35, 50, 70 µm

Glass transition temperature (Tg): 135°C (standard), 150°C, 170°C

Solder mask of different colors: green, white, black, red, blue, yellow

Silk screen available in white, black, red or yellow — white is standard on FR4, black on IMS Aluminium

Maximum panel size: 390 × 520 mm (1–2 layers). For multilayer PCBs (4–6 layers), the maximum panel size is: 335 × 440 mm

Minimum drill diameter: 0.3 mm with a 0.5 mm pad

Maximum drill diameter: 6.4 mm. Holes larger than 6.4 mm must be created by milling rather than drilling.

Minimum trace width: 0.15 mm

Minimum spacing between traces: 0.15 mm

HASL-LF (Hot Air Solder Level – Lead-Free) — RoHS compliance

100% electrical test (open and short circuits, Flying Probe) and AOI optical inspection on all printed circuit boards

Plated milling

Castellated holes: hole diameter > 1 mm, hole-to-hole spacing (pitch) 0.5 mm

Chamfering

One-side scoring

Depaneling process: V-Cut (Scoring), Milling

Manufacturing Recommendations

Trace & isolation by copper layer thickness

Recommended trace width and spacing scale with copper weight — thicker copper needs wider traces and gaps to etch cleanly and hold tolerance.

Base → final copper	Min. trace / spacing	With increased copper (final)	Recommended trace / spacing
FR4 18/18 µm base, up to 35/35 µm final	0.15 / 0.15 mm	up to 50 µm final	0.18 / 0.18 mm
FR4 35/35 µm base, up to 55/55 µm final	0.22 / 0.22 mm	up to 70 µm final	0.25 / 0.25 mm
FR4 70/70 µm base, up to 90/90 µm final	0.28 / 0.28 mm	up to 105 µm final	0.30 / 0.30 mm

Certifications & Compliance

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ISO 9001

Quality Management System. The certificate shows its number and validity.

View certificate →

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ISO 14001

Environmental Management System. The certificate shows its number and validity.